BOJACK IRLB3034 N-Channel MOSFET Transistor Pack of 5 High Power

Description

Product Overview

The BOJACK IRLB3034 is a premium N‑Channel MOSFET designed for high‑current, high‑efficiency applications. Built with a copper die, this transistor can dissipate up to 375 W at a modest 25 °C ambient temperature, delivering low on‑resistance and minimal heat buildup. Its TO‑220AB package provides a sturdy thermal interface, making it easy to mount on heat sinks for demanding power conversion tasks. The device features an enhanced body diode with rapid dV/dt and dI/dt capabilities, ensuring reliable reverse‑current protection and fast recovery during switching events. With a pack of five units, engineers gain flexibility for prototyping, production runs, or spare inventory, all while benefiting from BOJACK’s reputation for quality semiconductor components.

Usage

This MOSFET excels in a wide range of environments. In electric vehicle powertrains, its high current rating supports motor drive circuits and battery management systems, delivering smooth acceleration and regenerative braking. LED lighting designers rely on its low loss characteristics to maximize luminous efficacy and extend product lifespans. Smart‑home devices, such as security cameras and automated lighting, benefit from the fast switching speed and robust diode protection, ensuring reliable operation even under fluctuating power conditions. Industrial power supplies, motor controllers, and communication equipment also find a natural fit, as the IRLB3034 can handle sudden load changes without compromising stability. The component’s compact footprint and standard TO‑220AB footprint simplify board layout, allowing seamless integration into both new designs and legacy systems.

Why Choose Us

Choosing the BOJACK IRLB3034 means selecting a component backed by rigorous testing and a commitment to long‑term availability. Each transistor undergoes multiple quality checks, including thermal cycling, electrical stress, and parametric verification, guaranteeing consistent performance across the entire batch. BOJACK’s supply chain ensures that the five‑unit pack arrives safely packaged, reducing the risk of damage during transit. Our technical support team is available to assist with design queries, thermal management advice, and application optimization, providing engineers with the confidence to implement the MOSFET in critical systems. Additionally, the product complies with industry standards for safety and reliability, making it suitable for certification processes in automotive and industrial sectors.

Key Features

• High power rating of 375 W enables demanding load handling with minimal temperature rise.
• Copper die construction reduces on‑resistance, improving efficiency and lowering energy loss.
• Fast recovery body diode protects circuits from reverse currents and ensures rapid switching.
• TO‑220AB package provides excellent heat‑sink attachment for reliable thermal management.
• Comes with dedicated technical support and after‑sales service for seamless integration.

FAQ

What is the maximum current this MOSFET can handle?

The IRLB3034 can continuously conduct up to 30 A at 25 °C, with short‑term surge capability exceeding 60 A when properly heat‑sunk.

Is the MOSFET suitable for automotive applications?

Yes, its robust thermal performance, fast diode recovery, and compliance with automotive reliability standards make it ideal for vehicle power modules and motor control circuits.

How does the copper die improve performance compared to aluminum?

Copper has a lower resistivity than aluminum, which reduces the on‑resistance of the transistor. This results in lower conduction losses, higher efficiency, and better heat dissipation during high‑current operation.

Can I use this MOSFET in LED driver circuits?

Absolutely. The low on‑resistance and fast switching characteristics help maintain high luminous efficacy, while the enhanced body diode protects the LED strings from voltage spikes.

What thermal management is recommended for this device?

For continuous high‑current operation, attach the TO‑220AB package to a properly sized heat sink with thermal paste. Ensure adequate airflow or forced cooling in confined spaces to keep the junction temperature within safe limits.